Structure and method for tensile and compressive strained silicon germanium with same germanium concentration by single epitaxy step

ABSTRACT

A method of making a semiconductor device includes forming a first silicon germanium layer on a substrate, the first silicon germanium layer forming a portion of a first transistor; forming a second silicon germanium layer on the substrate adjacent to the first silicon germanium layer, the second silicon germanium layer forming a portion of a second transistor and having a germanium content that is different than the first silicon germanium layer and a thickness that is substantially the same; growing by an epitaxial process a compressively strained silicon germanium layer on the first silicon germanium layer, and a tensile strained silicon germanium layer on the second silicon germanium layer; patterning a first fin in the compressively strained silicon germanium layer and the first silicon germanium layer; and patterning a second fin in the tensile strained silicon germanium layer and the second silicon germanium layer.

DOMESTIC PRIORITY

This application is a continuation application of and claims priorityfrom U.S. patent application Ser. No. 15/201,929, filed on Jul. 5, 2016,entitled “STRUCTURE AND METHOD FOR TENSILE AND COMPRESSIVE STRAINEDSILICON GERMANIUM WITH SAME GERMANIUM CONCENTRATION BY SINGLE EPITAXYSTEP, which is a continuation of and claims priority from U.S. patentapplication Ser. No. 14/967,526, filed on Dec. 14, 2015, entitled“STRUCTURE AND METHOD FOR TENSILE AND COMPRESSIVE STRAINED SILICONGERMANIUM WITH SAME GERMANIUM CONCENTRATION BY SINGLE EPITAXY STEP,”each application is incorporated herein by reference in its entirety.

BACKGROUND

The present invention relates to complementary metal oxide semiconductor(CMOS), and more specifically, to silicon germanium (SiGe) materiallayers.

CMOS is used for constructing integrated circuits. CMOS technology isused in microprocessors, microcontrollers, static random access memory(RAM), and other digital logic circuits. CMOS designs may usecomplementary and symmetrical pairs of p-type and n-type metal oxidesemiconductor field effect transistors (MOSFETs) for logic functions.

The MOSFET is a transistor used for switching electronic signals. TheMOSFET has a source, a drain, and a metal oxide gate electrode. Themetal gate is electrically insulated from the main semiconductorn-channel or p-channel by a thin layer of insulating material, forexample, silicon dioxide or high dielectric constant (high-k)dielectrics, which makes the input resistance of the MOSFET relativelyhigh. The gate voltage controls whether the path from drain to source isan open circuit (“off”) or a resistive path (“on”).

N-type field effect transistors (nFET) and p-type field effecttransistors (pFET) are two types of complementary MOSFETs. The nFET useselectrons as the current carriers and with n-doped source and drainjunctions. The pFET uses holes as the current carriers and with p-dopedsource and drain junctions.

SUMMARY

According to an embodiment, a method of making a semiconductor deviceincludes forming a first silicon germanium layer on a substrate, thefirst silicon germanium layer forming a portion of a first transistor;forming a second silicon germanium layer on the substrate adjacent tothe first silicon germanium layer, the second silicon germanium layerforming a portion of a second transistor and having a germanium contentthat is different than the first silicon germanium layer of the firsttransistor, and the first silicon germanium layer and the second silicongermanium layer having substantially the same thickness; growing by anepitaxial process a compressively strained silicon germanium layer onthe first silicon germanium layer, and a tensile strained silicongermanium layer on the second silicon germanium layer; patterning afirst fin in the compressively strained silicon germanium layer and thefirst silicon germanium layer of the first transistor; and patterning asecond fin in the tensile strained silicon germanium layer and thesecond silicon germanium layer of the second transistor.

According to another embodiment, a semiconductor device includes asubstrate comprising a semiconductor material; a buried dielectric layerarranged on the substrate; a first transistor comprising a fin arrangedon the buried dielectric layer, the fin having a silicon germanium layerarranged on the buried dielectric layer and a compressively strainedsilicon germanium layer arranged on the silicon germanium layer; asecond transistor comprising a fin arranged on the buried dielectriclayer, the fin having a silicon germanium layer arranged on the burieddielectric layer and a tensile strained silicon germanium layer arrangedon the silicon germanium layer; and a gate positioned on the fin of thefirst transistor and the fin of the second transistor; wherein thecompressively strained strained silicon germanium layer and the tensilestrained silicon germanium layer have a germanium content that issubstantially the same.

Yet, according to another embodiment, a semiconductor device includes asubstrate comprising a semiconductor material; a buried dielectric layerarranged on the substrate; a first transistor comprising a fin arrangedon the buried dielectric layer, the fin having a first relaxed silicongermanium layer arranged on the buried dielectric layer and acompressively strained silicon germanium layer arranged on the silicongermanium layer; a second transistor comprising a fin arranged on theburied dielectric layer, the fin having a second relaxed silicongermanium layer arranged on the buried dielectric layer and a tensilestrained silicon germanium layer arranged on the silicon germaniumlayer, the second relaxed silicon germanium layer comprising a germaniumcontent that is greater than the first relaxed silicon germanium layer;and a gate arranged on the fin of the first transistor and the fin ofthe second transistor.

BRIEF DESCRIPTION OF THE DRAWINGS

The subject matter which is regarded as the invention is particularlypointed out and distinctly claimed in the claims at the conclusion ofthe specification. The foregoing and other features, and advantages ofthe invention are apparent from the following detailed description takenin conjunction with the accompanying drawings in which:

FIGS. 1-5 illustrate exemplary methods of making semiconductor devicesaccording to various embodiments, in which:

FIG. 1 is a cross-sectional side view of a first SiGe layer on a firsttransistor and a second SiGe layer on a second transistor;

FIG. 2 is a cross-sectional side view after growing SiGe layers havingthe same germanium content on the first and second SiGe layers;

FIG. 3A is a cross-sectional side view after patterning fins in thesemiconductor stacks;

FIG. 3B is a top view of FIG. 3A;

FIG. 4A is a cross-sectional side view after depositing a dielectricmaterial between the fins;

FIG. 4B is a top view of FIG. 4A;

FIG. 5 is a cross-sectional side view after depositing a gate stack onthe fins; and

FIG. 6 is a flow diagram illustrating a method of making a semiconductordevice according to an embodiment.

DETAILED DESCRIPTION

As CMOS nodes scale to smaller dimensions, device performance targetsmay present a challenge. For 10 nm and 7 nm FinFET devices, silicongermanium (SiGe) fins may be used to increase pFET performance. However,CMOS devices with dual channel materials, for example, SiGe fins andsilicon (Si) fins, are more challenging to fabricate than devices with asingle channel material. CMOS devices that include the same channelmaterial for pFET and nFET fins are often less complex to integrate.

Accordingly, various embodiments provide methods of making semiconductordevices with both tensile and compressively strained SiGe with the samegermanium content in a single process step. The tensile andcompressively strained SiGe regions may be used in nFET and pFETdevices, respectively, to form a CMOS structure having a single channelmaterial.

Turning now to the Figures, FIGS. 1-5 illustrate exemplary methods ofmaking semiconductor devices according to various embodiments. FIG. 1 isa cross-sectional side view of a first transistor 103 and a secondtransistor 104 arranged on a substrate 101. The substrate 101 mayinclude one or more semiconductor materials. The substrate 101 providesa support or handle substrate platform. Non-limiting examples ofsubstrate 101 materials include Si (silicon), strained Si, SiC (siliconcarbide), Ge (germanium), SiGe (silicon germanium alloy), SiGeC(silicon-germanium-carbon), Si alloys, Ge alloys, III-V materials (e.g.,GaAs (gallium arsenide), InAs (indium arsenide), InP (indium phosphide),or aluminum arsenide (AlAs)), II-VI materials (e.g., CdSe (cadmiumselenide), CdS (cadmium sulfide), CdTe (cadmium telluride), ZnO (zincoxide), ZnSe (zinc selenide), ZnS (zinc sulfide), or ZnTe (zinctelluride), or any combination thereof. The substrate 101 may include asingle layer or multiple layers.

The crystal orientation of the substrate 101 may be, for example, {100},{110} or {111}. Although other crystallographic orientations may beused. The substrate 101 may be a single crystalline semiconductormaterial, a polycrystalline material, or an amorphous material.

A first SiGe layer 111 is formed on the substrate 101 in the firsttransistor 103 area, and a second SiGe layer 121 is formed on thesubstrate 101 in the second transistor area 104. The first SiGe layer111 and the second SiGe layer 121 have different germanium contents andhave a substantially uniform thickness. The first SiGe layer 111 and thesecond SiGe layer 121 are relaxed (no strain). In some embodiments, thefirst SiGe layer 111 and the second SiGe layer 121 are 90 to 100%relaxed. The first SiGe layer 111 and the second SiGe layer 121 may beformed according to any methods.

The first SiGe layer 111 and the second SiGe layer 121 are arranged onburied dielectric layers 110 between isolation regions 102. The burieddielectric layer 110 may be, for example, a crystalline ornon-crystalline oxide or nitride. In one embodiment, the burieddielectric layer 110 is an oxide such as, for example, silicon dioxide.Other non-limiting examples of materials for the buried dielectric layer110 layer include an oxide, e.g., silicon oxide, a nitride, e.g.,silicon nitride, oxynitrides of silicon, e.g., silicon oxynitride, or acombination thereof. The insulator layer forming the buried oxide layer110 may be formed by various methods, including but not limited to, ionimplantation methods, thermal or plasma oxidation or nitridationmethods, chemical vapor deposition (CVD) methods, and physical vapordeposition (PVD) methods. The buried dielectric layer 110 may have athickness of 300 nm or less. In another embodiment, the burieddielectric layer 110 may have a thickness ranging from 2 nm to 150 nm.In yet another embodiment, the buried dielectric layer 110 may have athickness ranging from 5 nm to 30 nm.

In an exemplary embodiment, one method of forming the structure shown inFIG. 1 includes starting with a silicon-on-insulator (SOI) substrate.Active regions of the first transistor 103 and the second transistor 104are separated by shallow trench isolation (STI), and then the first SiGelayer 111 and the second SiGe layer 121 are formed out of the siliconlayer on top of the buried oxide layer in the SOI.

The germanium content in the first SiGe layer 111 and the second SiGelayer 121 may generally vary. In some embodiments, the first SiGe layer111 includes a germanium content in a range from about 10 to about 40at. %, and the second SiGe layer 121 includes a germanium content in arange from about 30 to about 80 at. %. In one exemplary embodiment,first SiGe layer 111 includes about 25 at. % germanium, and second SiGelayer 121 includes about 75 at. % germanium. In other embodiments, thefirst SiGe layer 111 includes a germanium content in a range from about10 to about 30 at. %, and the second SiGe layer 121 includes a germaniumcontent in a range from about 30 to about 80 at. %. Yet, in otherembodiments, the first SiGe layer 111 and the second SiGe layer 121 havea difference of germanium content of at least 30 at. %. Still yet, inother embodiments, the first SiGe layer 111 has a lower germaniumcontent than the second SiGe layer 121, which may be at least 30 at. %lower.

The thicknesses of the first SiGe layer 111 and the second SiGe layer121 generally vary. In some embodiments, the first SiGe layer 111 has athickness in a range from about 6 to about 1000 nm, and the second SiGelayer 121 includes has a thickness in a range from about 6 to about 1000nm. Although, first SiGe layer 111 and second SiGe layer 121 are notlimited to these thicknesses, as they may have any thicknesses providedthey are substantially the same.

FIG. 2 is a cross-sectional side view after growing by an epitaxialprocess a third SiGe layer 301 on the first SiGe layer 111 and a fourthSiGe layer 302 on the second SiGe layer 121. The third SiGe layer 302and the fourth SiGe layer 302 have the same or substantially the samegermanium content. The germanium content of the third SiGe layer 301 andthe fourth SiGe layer 302 may be, for example, in a range from about 30to about 70%. The germanium content of the third SiGe layer 301 and thefourth SiGe layer 302 is between the first SiGe layer 111 and the secondSiGe layer 121. In an exemplary embodiment, the third SiGe layer 301 andthe fourth SiGe layer 302 include 50 at. % germanium. In otherembodiments, the germanium content of the third SiGe layer 301 and thefourth SiGe layer 302 is in a range from about 30 to about 70 at. %.

The germanium content of the third SiGe layer 301 and the fourth SiGelayer 302 is in a range that is between the germanium content of thefirst SiGe layer 111 and the second SiGe layer 121. For example, whenthe first SiGe layer 111 includes 25 at. % germanium, and the secondSiGe layer 121 includes 75 at. % germanium, the third SiGe layer 301 andthe fourth SiGe layer 302 will include a germanium content in a rangefrom 25 at. % and 75 at. %. Using a germanium content in this rangeresults in making both tensile and compressively strained SiGe with thesame germanium content in a single epitaxial growth step.

Epitaxially growing the third SiGe layer 301 to include, for example, agermanium content of about 50 at. %, when the germanium content of thefirst SiGe layer 111 is about 25 at. %, results in the third SiGe layer301 being compressively strained. Likewise, epitaxially growing thefourth SiGe layer 302 to include a germanium content of about 50 at. %,when the germanium content of the second SiGe layer 121 is about 75 at.% results in the fourth SiGe layer 302 being tensile strained. The typeof strain, whether compressive or tensile, may be suitable for differenttypes of transistors. Compressive strained layers may be used in pFETs(for example, first transistor 103, and tensile strained layers may beused in nFETs (for example, second transistor 104). The degree of straindepends on the difference in germanium content between the first SiGelayer 111 and the third SiGe layer 301, and between the second SiGelayer 121 and the fourth SiGe layer 302. In an exemplary embodiment,when the third SiGe layer 301 includes 50 at. % germanium, and the firstSiGe layer 111 includes 25 at. % germanium, the third SiGe layer 301 hasabout 1% compressive strain. When the fourth SiGe layer 301 includes 50at. % germanium, and the second SiGe layer 121 includes 75 at. %germanium, the fourth SiGe layer 302 has about 1% tensile strain.

As mentioned above, the degree of tensile and compressive strain dependson the difference in germanium content successive layers, or moreparticularly, between the first SiGe layer 111 and the third SiGe layer301, and between the second SiGe layer 121 and the fourth SiGe layer302. The % strain can be measured using high resolution x-raydiffractometry to determine the lattice constants from which the straincan be calculated.

In some embodiments, the first SiGe layer 111 has a germanium contentthat is less than the germanium content of the compressively strainedthird SiGe layer 301, and the second SiGe layer 121 has a germaniumcontent that is greater than the germanium content of the tensilestrained fourth SiGe layer 302. In other embodiments, the germaniumcontent of the tensile strained fourth SiGe layer 302 and thecompressively strained third SiGe layer 301 is less than the germaniumcontent of the second SiGe layer 121 and greater than the germaniumcontent of the first SiGe layer 111.

In some embodiments, the third SiGe layer 111 has at least 1%compressive strain. In other embodiments, the third SiGe layer 301 hasabout 0.5 to about 2% compressive strain. Yet, in other embodiments, thefourth SiGe layer 302 has at least 1% compressive strain. Still yet, inother embodiments, the fourth SiGe layer has about 0.5 to about 2%compressive strain.

To ensure that the third SiGe layer 301 and the fourth SiGe layer 302are strained, the thickness of each of the layers is grown to athickness than is less than the critical thickness, or the thickness atwhich the strained layer relaxes. In some embodiments, the thickness ofthe third SiGe layer 301 and the fourth SiGe layer 302 is in a rangefrom about 10 to about 50 nm.

FIG. 3A is a cross-sectional side view after patterning fins in thethird SiGe layer 301 and the fourth SiGe layer 302. FIG. 3B is a topview of FIG. 3A. The fins 401 of the first transistor 103 are patternedthrough the third SiGe layer 301 and the first SiGe layer 111, stoppingon the buried dielectric layer 110. The fins 402 of the secondtransistor are patterned through the fourth SiGe layer 302 and thesecond SiGe layer 121, stopping on the buried dielectric layer 110. Thefin formation patterning does not affect the strain state of the activefin regions, defined by the third SiGe layer 301 and the fourth SiGelayer 302. The fins 401 and fins 402 may be patterned by, for example,sidewall imaging transfer (SIT).

FIG. 4A is a cross-sectional side view after depositing a dielectricmaterial 501 between the fins 401 of the first transistor 103 andbetween the fins 402 of the second transistor 104. FIG. 4B is a top viewof FIG. 5A.

Non-limiting examples of materials for the dielectric material 501include dielectric oxides (e.g., silicon oxide), dielectric nitrides(e.g., silicon nitride), dielectric oxynitrides, or any combinationthereof. The dielectric material 501 may be deposited by a depositionprocess, for example, chemical vapor deposition (CVD) or physical vapordeposition (PVD). After depositing the dielectric material 501, a dryetch process, for example, RIE, may be used to etch the dielectricmaterial 501 down to a level below the third SiGe layer 301 and thefourth SiGe layer 302.

FIG. 5 is a cross-sectional side view after depositing a gate stack 601on the fins 401 and a gate stack 602 on the fins 402. The materials andthickness may differ between the compressively strained third SiGe layer301 and the tensile strained fourth SiGe layer 302.

The gate stack 601 and gate stack 602 may include gates formed bydepositing one or more dielectric materials, one or more workfunctionmetals, and one or more metal gate conductor materials. The gatedielectric material(s) can be a dielectric material having a dielectricconstant greater than 3.9, 7.0, or 10.0. Non-limiting examples ofsuitable materials for the dielectric material include oxides, nitrides,oxynitrides, silicates (e.g., metal silicates), aluminates, titanates,nitrides, or any combination thereof. Examples of high-k materials (witha dielectric constant greater than 7.0) include, but are not limited to,metal oxides such as hafnium oxide, hafnium silicon oxide, hafniumsilicon oxynitride, lanthanum oxide, lanthanum aluminum oxide, zirconiumoxide, zirconium silicon oxide, zirconium silicon oxynitride, tantalumoxide, titanium oxide, barium strontium titanium oxide, barium titaniumoxide, strontium titanium oxide, yttrium oxide, aluminum oxide, leadscandium tantalum oxide, and lead zinc niobate. The high-k material mayfurther include dopants such as, for example, lanthanum and aluminum.

The gate dielectric material layer may be formed by suitable depositionprocesses, for example, chemical vapor deposition (CVD), plasma-enhancedchemical vapor deposition (PECVD), atomic layer deposition (ALD),evaporation, physical vapor deposition (PVD), chemical solutiondeposition, or other like processes. The thickness of the dielectricmaterial may vary depending on the deposition process as well as thecomposition and number of high-k dielectric materials used.

The work function metal(s) may be disposed over the gate dielectricmaterial. The type of work function metal(s) depends on the type oftransistor. Non-limiting examples of suitable work function metalsinclude p-type work function metal materials and n-type work functionmetal materials. P-type work function materials include compositionssuch as ruthenium, palladium, platinum, cobalt, nickel, and conductivemetal oxides, or any combination thereof. N-type metal materials includecompositions such as hafnium, zirconium, titanium, tantalum, aluminum,metal carbides (e.g., hafnium carbide, zirconium carbide, titaniumcarbide, and aluminum carbide), aluminides, or any combination thereof.The work function metal(s) may be deposited by a suitable depositionprocess, for example, CVD, PECVD, PVD, plating, thermal or e-beamevaporation, and sputtering.

A conductive metal is deposited over the dielectric material(s) andworkfunction layer(s) to form the gate stacks. Non-limiting examples ofsuitable conductive metals include aluminum (Al), platinum (Pt), gold(Au), tungsten (W), titanium (Ti), or any combination thereof. Theconductive metal may be deposited by a suitable deposition process, forexample, CVD, PECVD, PVD, plating, thermal or e-beam evaporation, andsputtering. A planarization process, for example, chemical mechanicalplanarization (CMP), is performed to polish the surface of theconductive gate metal.

FIG. 6 is a flow diagram illustrating a method of making a semiconductordevice according to an embodiment. In box 601, the method includesforming a first silicon germanium layer on a substrate. The firstsilicon germanium layer forms a portion of a first transistor. In box602, a second silicon germanium layer is formed on the substrateadjacent to the first silicon germanium layer. The second silicongermanium layer forms a portion of a second transistor and has agermanium content that is different than the first silicon germaniumlayer of the first transistor. The first silicon germanium layer and thesecond silicon germanium layer have substantially the same thickness. Inbox 603, a compressively strained silicon germanium layer is grown by anepitaxial growth process on the first silicon germanium layer, and atensile strained silicon germanium layer is grown on the second silicongermanium layer. In box 604, a first fin is patterned in thecompressively strained silicon germanium layer and the first silicongermanium layer of the first transistor. In box 605, a second fin ispatterned in the tensile strained silicon germanium layer and the secondsilicon germanium layer of the second transistor.

As described above, various embodiments provide methods of makingsemiconductor devices with both tensile and compressively strained SiGewith the same germanium content in a single epitaxial growth processstep. The tensile and compressively strained SiGe regions may be used innFET and pFET devices, respectively, to forma a CMOS structure having asingle channel material.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

What is claimed is:
 1. A semiconductor device, comprising: a firsttransistor comprising a fin arranged on a substrate, the fin having afirst relaxed silicon germanium layer arranged on the substrate and acompressively strained silicon germanium layer arranged on the firstrelaxed silicon germanium layer; and a second transistor adjacent to thefirst transistor and comprising a fin arranged on the substrate, the finof the second transistor having a second relaxed silicon germanium layerarranged on the substrate and a tensile strained silicon germanium layerarranged on the second relaxed silicon germanium layer, the secondrelaxed silicon germanium layer comprising a germanium content that isdifferent than the first relaxed silicon germanium layer.
 2. Thesemiconductor device of claim 1, wherein the first transistor is a pFET.3. The semiconductor device of claim 2, wherein the second transistor isan nFET.
 4. The semiconductor device of claim 1, wherein a germaniumcontent of the tensile strained silicon germanium layer is less than agermanium content of the second relaxed silicon germanium layer.
 5. Thesemiconductor device of claim 4, wherein a germanium content of thecompressively strained silicon germanium layer is less than thegermanium content of the second relaxed silicon germanium layer.
 6. Thesemiconductor device of claim 4, wherein the germanium content of thetensile strained silicon germanium layer is greater than a germaniumcontent of the first relaxed silicon germanium layer.
 7. Thesemiconductor device of claim 5, wherein the germanium content of thecompressively strained silicon germanium layer is greater than agermanium content of the first relaxed silicon germanium layer.
 8. Thesemiconductor device of claim 1, wherein a thickness of the firstrelaxed silicon germanium layer of the first transistor is in a rangefrom about 6 to about 1000 nm.
 9. The semiconductor device of claim 1,wherein a thickness of the second relaxed silicon germanium layer of thesecond transistor is in a range from about 6 to about 1000 nm.
 10. Thesemiconductor device of claim 1, wherein the compressively strainedstrained silicon germanium layer and the tensile strained silicongermanium layer have a germanium content that is substantially the same.11. The semiconductor device of claim 1, wherein a thickness of thecompressively strained silicon germanium layer is in a range from about10 to about 50 nm.
 12. The semiconductor device of claim 1, wherein athickness of the tensile strained silicon germanium layer is in a rangefrom about 10 to about 50 nm.
 13. A semiconductor device, comprising: afirst fin arranged on a substrate, the first fin comprising a firstrelaxed silicon germanium layer and a compressively strained silicongermanium layer arranged on the first relaxed silicon germanium layer;and a second fin arranged on the substrate, the second fin comprising asecond relaxed silicon germanium layer and a tensile strained silicongermanium layer arranged on the second relaxed silicon germanium layer,the second relaxed silicon germanium layer comprising a germaniumcontent that is different than the first relaxed silicon germaniumlayer.
 14. The semiconductor device of claim 13, wherein the first finis a portion of a pFET.
 15. The semiconductor device of claim 13,wherein the second second fin is a portion of an nFET.
 16. Thesemiconductor device of claim 13, wherein a germanium content of thetensile strained silicon germanium layer is less than a germaniumcontent of the second relaxed silicon germanium layer.
 17. Thesemiconductor device of claim 16, wherein a germanium content of thecompressively strained silicon germanium layer is less than thegermanium content of the second relaxed silicon germanium layer.
 18. Thesemiconductor device of claim 16, wherein the germanium content of thetensile strained silicon germanium layer is greater than a germaniumcontent of the first relaxed silicon germanium layer.
 19. Thesemiconductor device of claim 17, wherein the germanium content of thecompressively strained silicon germanium layer is greater than agermanium content of the first relaxed silicon germanium layer.
 20. Thesemiconductor device of claim 13, wherein a thickness of the firstrelaxed silicon germanium layer of the first transistor is in a rangefrom about 6 to about 1000 nm.